encapsulant
英
美
n. 密封剂；胶囊密封材料；封装物，密封物
双语例句
- Embodiments of the disclosure include use as a wafer level underfill, and an encapsulant for electronic chips.
本发明的实施方案包括作为晶片级底层填料和电子芯片密封剂的用途。 - This curable materials could be used in organic encapsulant.
此材料可以做为有机封装材。 - Synthesis of Liquid Crosslinking Agent for Light Emitting Diode Encapsulant
LED封装用液体交联剂的制备与表征 - The carbon black-filled powdered SBR was prepared with coacervation-coprecipitation method using SBR latex as raw rubber material, N 330 as reinforcing filler and polymeric resin as encapsulant.
用SBR胶乳、高耐磨炭黑为原料，高分子树脂为炭黑表面改性剂兼包覆剂，以凝聚共沉法制备了炭黑填充型粉末SBR； - Interaction among Si in LEC GaAs and b_2o_3 and h_2o in the encapsulant
LEC法GaAs中的Si与液封剂B2O3，H2O间的相互作用 - Analysis of the stoichiometrical rate of InP by Rutherford backscattering spectrometry shows that the decomposition of InP is greatly suppressed by using a SiO2 encapsulant.
利用离子背散射分析了激光再结晶前后InP化学计量比的变化，结果表明：采用SiO2保护膜后较好地抑制了InP组分的分解。 - Building Encapsulant Coating Agents for Textiles
建筑用密封剂织物用涂层胶 - The results from encapsulation peel tests, die and encapsulant pull tests, bonding wire pull tests and C-Mode SAM ( C-SAM) examination are presented. This paper demonstrates that the optimized plasma cleaning process would enhance PBGA package qualification level and improve the process yields and productivity.
陈述了密封剥离试验、芯片和密封剂拉力试验、焊线拉力试验和C-模式SAM（C-SAM）检查的结果，证明了最佳的等离子清洗工艺会增强PBGA封装的定性等级，并提高工艺效率和生产率。 - The modified kaolinite-filled SBR powder was prepared by coacervation-coprecipitation method in using polymeric resin as the encapsulant.
以SBR胶乳为原料，经表面改性的高岭土（MO）为填料，高分子树脂为包覆剂，以凝聚共沉法研制高岭土填充型粉末SBR[P（SBR/MO）]。 - Application of Polysiloxane to Modification of Epoxy Encapsulant
聚硅氧烷在环氧封装料改性中的应用 - Building Encapsulant On the Liability of Employer
建筑用密封剂雇主责任问题研究 - The encapsulant for electronics packaging usually exhibits rheological behaviour and its viscosity is dependent on the shear rate, temperature, and even on the shear time, so the fluid flow rate in dispensing is largely affected by it.
点胶中胶体的粘性不是一个常数，流体粘性依赖于剪切应变、温度甚至剪切时间，因而胶体流速和体积受其影响很大。 - The Epoxy Molding Compound ( EMC) has extensively used as an encapsulant for electronic packages to protect the IC chips from mechanical and chemical hazards.
环氧模塑封（EMC）材料已广泛应用于微电子封装，为集成电路芯片提供机械支撑并保护集成电路芯片免受化学危害。