flip-chip
英 [flɪp tʃɪp]
美 [flɪp tʃɪp]
n. 倒装法；倒装芯片
双语例句
- Thermal fatigue failure, due to the fracture of solder bumps which was cased by the coefficient of thermal expansion mismatch deformation, is frequently encountered in flip-chip package.
电子元件常会因晶片、基板或电路板的热膨胀系数的差异，而在使用上产生热应力与应变，而造成元件的疲劳损坏。 - FC-BGA Flip-Chip Ball Grid Array
反转芯片球形栅格阵列 - Effects of the Size Parameters of Flip-chip Device on Low-K Layer and Solder Joints Reliability
倒装焊器件尺寸参数对低k层及焊点的影响 - FC-BGA Flip-Chip Ball Grid Array From there rose the rattle and chatter and whistling.
反转芯片球形栅格阵列那儿发出一阵阵格格声、人语声和哨声。 - Impact of Stencil for Flip-Chip Shape and Their Reliability Study
模板对倒装焊焊点形态的影响及其可靠性研究 - The design describes the structure of compound die stamping flip-chip design and working process.
本次设计阐述了冲压倒装复合模的结构设计以及工作过程。 - Underfill technology effectively enhances the flip-chip cycle fatigue life and reliability of packaging process.
有机基板上的倒装芯片一般采用底部填充技术以提高其封装的可靠性。 - The Au – Sn flip-chip joints were formed at300 and400 ℃ without using any flux.
不用任何助溶剂金锡倒装晶片连接点可在300-400℃时形成。 - The sensor chip is flip-chip packaged on a thin ceramic substrate using copper pillar bump technology.
该传感器使用铜柱凸点技术，倒装于薄层陶瓷上。 - In the aspect of thermal dispersion for power LEDs, flip-chip configuration has potential predominance.
与正装LED相比，倒装焊芯片技术在功率型LED的散热方面具有潜在的优势。 - FC-PGA Flip-Chip Pin Grid Array
反转芯片针脚栅格阵列 - Influence of Temperature on Alignment Accuracy in the Thermosonic Flip-chip Bonding
热超声倒装键合中温度对对准精度的影响 - The design of micro-strip in modules and application of the flip-chip are described.
阐述了模块中微带线的设计，以及倒扣封装的实现。 - Flip-chip bonding technology is a potential process in the electronic packaging.
凸点芯片倒装焊接是一种具有发展潜力的芯片互连工艺技术。 - Flip-chip Bonding Technology Application of Electroplating Technology to Solder Bumping Formation
凸点芯片倒装焊接技术电镀技术在凸点制备工艺中的应用 - Research on Flip-chip Key Technologies
Flip-chip芯片关键技术的研究 - Transfer of Metal Elements and Microstructure Evolution in Flip-Chip Solder Joint
倒装焊焊点中金属元素迁移及组织演变 - Based on minimal energy principle, Evolving model of flip-chip 3-D shape prediction of MCM is established, and 3-D solder shape is effectively predicted.
基于最小能量原理建立了多芯片组件（MCM）倒装焊焊点成形预测模型，对其三维焊点形态进行了有效预测。 - Research on Flip-chip Bonding Techniques for Hybrid Focal Plane Array Applications
混成式焦平面阵列芯片倒装互连技术研究 - This paper briefly analyzes the difficulties of MEMS packaging, and elaborates the key techniques of packaging, such as wafer-bonding, wafer level packaging and flip-chip technique. grade.
简要分析了MEMS（微机电系统）器件封装的难点所在，随后介绍了晶片键合，晶片级密封，倒装芯片技术等主要的MEMS封装技术。 - The technologies of MEMS packaging are introduced, including three promising technologies: wafer level packaging, single-chip packaging and multi-chip packaging, modular MEMS packaging and flip-chip bonding for MEMS packaging.
介绍了微机电（MEMS）封装技术，包括晶片级封装、单芯片封装和多芯片封装、模块式封装与倒装焊3种很有前景的封装技术。 - Integrated Flip-Chip in Standard Surface Mount Technology
在标准表面安装工艺中集成倒装芯片 - The stability and the delay time of the scan working model trigger system and the interrupt working model trigger system were compared and studied by the experiment of synchronization trigger of the thermosonic flip-chip bonding.
通过热超声倒装键合测量系统同步触发实验对比研究了单片机扫描工作模式和单片机中断工作模式触发系统的稳定性和触发延迟方面的性能。 - Solder Bump Flip-Chip Bonding Technology
凸点芯片倒装焊接技术 - Because of the complex of the geometry material, it is very hard to resolute the thermal stress distribution in Flip-Chip encapsulation, but the numerical value method, for instance finite element analysis, has been used in the studying of thermal stress and thermal strain.
由于几何材料的复杂性，倒装芯片封装中的热应力分布很难用解析的方法求解，而数值方法，如有限元法，已被广泛用于热应力应变的研究。 - The preparation of metal bump and wire substrate have been researched, as well as flip-chip bonding technology.
对金属凸点、引线衬底的制备以及倒装焊接技术进行了研究。 - This is the one of main reasons of the flip-chip package failure.
这也是倒装封装失效的主要原因。 - A simplified heat transfer model of Flip-Chip BGA packaging was built up. The impinging jet cooling effect was analyzed by Thermal Profile method.
以FC-BGA芯片为冷却对象，建立其简化传热模型，采用热型线法对冲击射流散热方式进行了分析。 - The flip-chip method can not only reduce dimensions, save costs, but also make improvement in heat dissipation, luminous efficiency and homogeneity.
结果表明本文的倒装实现方法不但缩小了尺寸、节省了成本，而且使得器件散热性、发光效率和均一性均有所提高。