It is also necessary to do thermo-mechnical modeling of thermal through silicon via ( TTSV) and thin stack die ( including adhesive and interposer) and the impact on active devices and interconnect. 有必要进行热硅通孔和薄的堆叠晶片(包括粘结层或者中介层)的热-力建模及其对有源器件和互连线影响的研究。