Meanwhile, the high risk of punch-through due to process limitation was described when channel length became smaller and source junction became shallower. m时,由于制造工艺的局限性以及沟道长度变短、结深变浅后,器件穿通风险加大。
Measurements of the direct-current properties of a punch-through phototransistor 穿通型光电晶体管的直流特性测试
Working in a deep punch-through state during its normal operating condition, it still possesses all the characteristics of the robust non-punch-through IGBT ( NPT-IGBT). 虽然在正常工作条件下,该新结构IGBT工作于穿通状态,但器件仍具有非穿通IGBT(NPT-IGBT)的优良特性。
Improving Source-Drain Punch-Through Voltage in 2-μ m p-Well CMOS Process 2μmp阱CMOS工艺中提高源-漏穿通电压的方法
When the bias voltage was greater than the punch-through voltage, we found that the detector capacitance decreases with the increasing frequency, and increases with the increasing temperature. 当探测器两端的偏置电压大于穿通电压时,发现探测器的电容随着频率的增大而减小,随测试温度的升高而增大。
To ensure the push-pull output of the power devices to work safely without the phenomenon of punch-through, it consists of typically 1.1 μ s dead time. 为保证图腾柱输出的功率器件能安全工作而不发生直通现象,内设典型值为1.1μs的死区时间。
However, the channel length of traditional UMOSFET is restricted by punch-through breakdown effect. 但是,传统的UMOSFET的沟槽长度的减小受体区穿通击穿效应的限制。
A novel IFO technology is proposed for high side thick gate oxide device to avoid punch-through breakdown induced by thin layer SOI back-gate effect. The technology includes a criterion of the punch-through breakdown and an implantation process for precise control of the punch-through breakdown voltage. 提出一种场氧离子注入IFO技术。该技术包含一个穿通击穿电压判据和一项注入工艺设计,可精确控制薄膜SOI背栅效应导致的高端厚栅氧器件的穿通击穿电压。