scribing
英 [ˈskraɪbɪŋ]
美 [ˈskraɪbɪŋ]
网络 划线; 划片; 切割; 劃線; 切割线
双语例句
- The traditional scribing instrument has the problems of complicated structure and inconvenient horizontal adjustment.
传统的划线仪存在着结构复杂，水平调整不便的问题。 - The work efficiency and the dimensional accuracy of scribing of the woodworker can be raised, and the work can be reduced.
可提高木工划线工作效率和尺寸精确度并能减轻劳动。 - In addition to the problem sets, each student is responsible for scribing one lecture and editing one lecture.
除了问题集之外，每个学生都要负责一堂课的笔记和一堂课的编辑。 - The utility model is composed of a central shaft road, a turning block, and a scribing needle.
本实用新型是由中心轴杆、转动滑块和划针组成。 - If you are interested in scribing specific topics, let us know by email, otherwise, volunteers will be chosen at the beginning of each lecture.
如果你有兴趣担任某堂课的笔记，请用电子邮件告知我们，不然的话，在每堂课的开始时将会挑选自愿者。 - The utility model is composed of a rail, a longitudinal spacing board, a scribing assembly, a transversal spacing pile, a set screw, etc.
它是由导轨、纵向限位板、划线组件和横向限位桩以及顶丝等部件组成。 - But as the couple made their way down the festival's famous Croisette in a chauffeur-driven car afterwards, the four-part scribing on her left shoulder was plainly visible.
而之后，当这对情侣乘车沿着戛纳著名的海滨大道前行时，茱丽左肩上的四部分纹身清晰可见。 - A slidable caliper head is additionally arranged on the scribing feet combined with the fixed plate, and the caliper head is provided with an adjustable scribing needle.
在与固定板结合的划脚上增加了一个可滑动的卡尺头，卡尺头上有一可调划针。 - A trainee can become competent in scribing more quickly than in pen and ink work.
初学者掌握刻图技术，要她用绘图笔蘸墨图更为迅速。 - The technique of scribing produces a negative image.
刻图制作出一张阴像地图。 - Die: A single piece of semiconductor material that has been cut from a slice by scribing and breaking.
硅晶圆大圆片上切割而成的一个小片半导体材料。 - Study on laser scribing of Al_2O_3 ceramic substrate with RF CO_2 laser
射频激光对氧化铝陶瓷基片划片的研究 - Through numerical simulation and experiment, the influences of factors such as frequency of pulse, pulse width, scribing speed, pressure of assistant air on the quality of laser scribing are investigated.
通过数值模拟和实验，分析了脉冲频率、脉冲宽度、划片速度、辅助气压大小、离焦量等工艺参数对激光划片质量的影响。 - The Pneumatic Control System for IC Scribing and Assembling
IC划片、组装气动控制系统 - Laser Scribing System for Amorphous Silicon Solar Cells
非晶硅太阳电池的激光刻划 - Effect of laser scribing on domain and hysteresis loss of stalloy
激光处理对硅钢片磁畴和磁滞损耗的影响 - Laser scribing of InSb wafer was studied and the relationship between process parameters ( pulse frequency, electrical current and traverse speed) and groove depth and width has been obtained.
研究了对InSb的激光划片过程，得出了刻槽深度和宽度随着脉冲重复频率、工作电流和刻划速度的变化规率。 - Research of technical parameters of Nd ∶ YAG laser scribing silicon film solar cell
Nd∶YAG激光器切割硅薄膜太阳能电池的工艺参数研究 - Laser scribing process of CdTe films was studied by Q-modulated pulse Nd: YAG laser. The dependence of the morphology of scribing line has been obtained with the function of pumped lamp current, frequency of pulse, scribing rate.
研究声光调Q的Nd：YAG激光对碲化镉薄膜的刻划过程，得出了刻槽形貌随脉冲重复频率、灯电流大小和刻划速率变化的规律。 - In this paper, specification, parameter and grinding way of scribing wheel for AMLCD glass substrates scribing is introduced. The relationships between cutting trace and grinding way, scribing depth and wheel top angle, probability of lateral crack generation and wheel top angle are investigated.
介绍了AMLCD基板玻璃切割刀轮的规格、物理参数、研磨方式，研究了研磨方式与切痕、刀轮角度与切割深度、刀轮角度与Lateralcrack的比率之间的关系。 - Optics Technology on Precision Laser Scribing Machine
精密激光刻划机中的光学技术 - In the process of TFT-LCD manufacturing, effects of optimized scribing and breaking parameters, such as scribe-wheel angle, cut pressure and press amount on the cell process and module process are studied.
在TFT-LCD切割裂片制程中，研究了刀轮角度、切割压力、切入量等工艺条件的优化对后段cell制程和module制程的影响。 - Laser scribing technique is an effective scribing method in semiconductor industry and Q switched Nd: YAG laser is most widely used for scribing semiconductor material.
激光划片是半导体工业中一种有效的划片方法。目前在半导体材料划片中多采用调QNd：YAG激光器。 - Study on Laser Scribing of InSb Wafer
InSb的激光划片研究 - Study on laser scribing of CdTe films
激光刻划碲化镉薄膜研究 - When scribing wheel selected, what must be taking into account first is the influence of wheel top angle to lateral crack, as the deeper crack also can be generated by large pressure.
由于切割深度可以由加大刀轮的下压量和增大切割压力来获得，因此在刀轮的选择上应首先考虑刀轮角度对Lateralcrack的影响。 - Laser scribing of InSb with a Q switched Nd: YAG laser was studied in this paper and the relationship between pulse frequency and groove depth and width has been obtained.
研究了利用调QNd：YAG激光对InSb的激光划片，得出了刻槽深度和宽度与脉冲重复频率之间的关系。 - In addition, It was found that by scribing initial crack on the outer surface of the glass tubes, better cutting quality of glass tubes can be obtained.
另外通过在玻璃管外表面预置初始微裂纹可改善玻璃管的切割质量。 - Results showed that the optimization model is stable and reliable and can effectively solve the process parameters optimization problem in grain-oriented silicon steels online scribing.
结果表明：此优化模型稳定可靠，可以解决取向硅钢在线刻痕参数的优化问题。 - Laser scribing developed on the basis of laser marking. It irradiates on the work-pieces using high energy density laser, produces chemical reaction and makes permanent indicator.
激光刻线技术是在激光打标技术的基础上发展起来的，利用高能量密度的激光照射工件，局部发生化学反应，从而留下永久标记。