solderability
英 [ˌsɒldərəˈbɪlɪti]
美 [ˌsɑdərəˈbɪlɪti]
网络 焊锡性; 可焊性; 焊錫性; 焊接性; 可焊性测试
双语例句
- SOLDERABILITY: According to lead free soldering profiles.
可焊性：根据无铅焊接概况。 - Are solderability test samples archived for one year?
焊锡性样品是否至少保留一年？ - The solderability of as-plated Pd coatings produced under different process conditions is good.
镀态下，不同条件下制得的钯镀层具有良好的沾锡能力。 - Microstructure and Solderability of Sn-Ag-Cu Lead-free Solder Powder and Alloy
Sn-Ag-Cu无铅钎料粉末与合金的组织及钎焊性能对比 - Low resistance, High allurly, Copper terminal with prefect solderability.
低阻值，高精度，采用铜引出端保证良好的焊接性。 - Superior solderability and resistance to soldering heat.
优良的可焊性及耐热冲击性。 - Excellent terminal strength and solderability due to structure of a metal plate terminal electrode.
优秀的终端强度和可焊性，由于结构的金属板端子电极。 - This paper deals with results of solderability testing.
本文论述焊料可焊性试验的结果。 - The environment of storage can affect the solderability of surface.
存储环境对表面的可焊性有影响。 - Each displays different properties for solderability, etc.
每一种类型都有不同的特性和焊锡性。 - The effect of the content of copper on melting point, strength, solderability is emphatically discussed.
在熔融状态下无铅焊料合金的行为是影响电子产品微连接钎焊性的关键因素。 - Specially including nitrogen chamber to evaluate the effect of nitrogen protection on solderability.
特别配有氮气保护腔，用于评价氮气保护条件对可焊性的影响。 - Test method of solderability for printed boards
GB/T4677.10-1984印制板可焊性测试方法 - That is why the solderability was measured before and after ageing also.
这就是为什么可焊性要在老化之前和之后分别进行测量。 - Be assure high frequency stability& excellent solderability.
确保高频率稳定性及良好的焊接性。 - High solderability due to specially plated electrodes.
具高可焊性特殊电极端子。 - SOLDERABILITY: Wave solder, no wash.
可焊性：波焊，不洗。 - Effect of cerium on solderability of tin coating on electronic component lead was studied.
探讨了稀土元素铈对电子元器件引线镀锡层可焊性的影响。 - The electroplated tin-lead alloy has been widely applied in electronic industry for its excellent solderability and whisker-free crystal.
锡铅合金因其优良的可焊性和耐锡须性能广泛应用于电子工业中。 - The experimental results show that the surface processing improves not only the solderability and bond strength of thermoelectric material slices but also the reliability and thermoelectric performance of thermoelectric module.
该工艺实验表明，材料片经表面处理后，不仅提高了可焊性和结合强度，而且提高了组件的可靠性和热电性能； - Deposit properties such as porosity, solderability and adhesion were tested.
测定了锡镀层的孔隙率、可焊性和结合力。 - Therefore, solderability of Sn Pb alloy deposit was tested for qualified MLCI products.
对锡-铅合金镀层的耐焊性和可焊性进行了检验以获得合格的MLCI产品。 - The Process Study of Corrosion Resistance and Solderability of Aluminum Alloy
铝合金封装外壳耐蚀性和可焊性工艺研究 - Studies on Solderability of Tin and Tin Alloy Coatings
锡和锡基合金镀层的可焊性研究 - Heterogeneous microstructure coarsening can reduce the solderability of the solder.
组成偏离及微结构粗化致使焊料在铜上的润湿性降低，并影响焊料的可焊性。 - The solderability of tin deposit is determined by wettability between deposit and substrate.
镀层与基体的润湿程度可用于检测镀锡层可焊性。 - On Solderability to Tiny Joint of Electronic Products When Melting Lead-free Solder
熔融无铅焊料对电子产品微连接的钎焊性研究 - This Paper proposed solutions for the semiconductor chip and package substrate solderability provide useful help and reference information.
论文提出的解决方案为半导体封装中芯片与基板可焊性提供有益帮助和参考。 - Electroless nickel of low-phosphorous coatings have been widely applied in electronic fields because of its great solderability.
低磷化学镀镍因其优异的可焊性而被广泛的应用在电子领域。