solders

英 [ˈsəʊldəz] 美 [ˈsɑːdərz]

n.  焊料; 焊锡
v.  焊接; 焊合
solder的第三人称单数和复数

柯林斯词典

  1. VERB 焊;焊接;焊合
    If you solder two pieces of metal together, you join them by melting a small piece of soft metal and putting it between them so that it holds them together after it has cooled.
    1. Fewer workers are needed to solder circuit boards...
      焊接电路板需要的工人更少了。
    2. He then soldered the wire to the telephone terminal...
      接着他把电话线焊接到电话机上。
    3. He cuts the pieces and solders them together.
      他把那些断片切碎，然后把它们焊在一起。
  2. 焊料;焊锡
    Solder is the soft metal used for soldering.
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    双语例句

    1. He cuts the pieces and solders them together.
      他把那些断片切碎，然后把它们焊在一起。
    2. It has been the trend to use lead-free solders in microelectronics and semiconductor industries.
      很明显地，使用无铅焊料在微电子与半导体工业已是一必然趋势。
    3. Microstructure, Mechanical Property and Interfacial Reaction of Sn-Cu Based Multicomponent Lead-Free Solders
      Sn-Cu基多组元无铅钎料组织、性能及界面反应研究
    4. Research development of high temperature lead-free solders for electronic assembly
      电子组装用高温无铅钎料的研究进展
    5. A Study of the Plating Process for Preparing Sn-Cu Lead-Free Solders by Electrodeposition
      电沉积制备Sn-Cu无铅钎料电镀工艺的研究
    6. Design and Study on Properties in Sn-Based High Multicomponent Temperature Lead-Free Solders
      Sn基多组元高温无铅焊接材料的设计及性能研究
    7. So, it is an urgent issue to study suitable lead-free solders in current electronic Industries.
      研究发展出适当的无铅焊料，已是电子工业现今的当务之急。
    8. Technology of Ultrasonic Brazing of Aluminum by Sn-Zn Solders and Strengthening Mechanism of Joint
      Sn-Zn钎料超声钎焊铝合金工艺及接头强化机制研究
    9. Effect of Alloying Elements and Aging on Microstructure and Solder Interface of Sn-Zn Lead-free Solders
      合金元素及时效处理对Sn-Zn无铅钎料组织和钎焊界面的影响
    10. Current situation on Sn-Zn lead-free solders affected with micro alloying elements
      微量元素对Sn-Zn系钎料性能和组织的影响
    11. Microstructure and properties of Sn-Zn-Bi-( P, Nd) lead-free solders
      Sn-Zn-Bi-（P，Nd）无铅钎料的微观组织及性能
    12. The requirement of the cleaning level is more than the water on metal, for there must be close bonding between solders and metals.
      其清洁水准的要求比水于金属板上还要高很多，因为焊锡和金属之间必需是紧密的连接。
    13. We fused the pipes with solders.
      我们用焊锡熔接管子。
    14. Research of New Sn-Ag Based Lead-free Composite Solders Containing Nano-structured Reinforcements
      纳米结构强化的新型Sn-Ag基无铅复合钎料
    15. Cookson, which makes ceramic products for the steel industry and solders for the electronics industry, generates 42 per cent of its profits in China – but the market accounts for only 23 per cent of group revenues.
      Cookson生产钢铁业使用的陶瓷产品，并为电子行业提供焊料。该公司42%的利润来自中国&但这一市场在集团收入中所占比例仅为23%。
    16. Effect of Cu and Ni on microstructure and properties of Sn-Zn-Al lead-free solders
      Cu，Ni对Sn-Zn-Al无铅焊料组织和性能的影响
    17. Solders ate a great number of potatoes during World War II.
      第二次世界大战期间的士兵吃了很多的土豆。
    18. Recently, numerous studies have been published on lead-free solders.
      近年来人们已对无钎焊料进行了广泛的研究。
    19. Effects of different fluxes on the characteristics of Sn-Zn solders
      不同钎剂对Sn-Zn系无铅钎料润湿特性的影响
    20. Influence of Cu on Properties of Zn-Al Solders for Al/ Cu Brazing
      Cu元素对铝/铜钎焊用Zn-Al钎料性能的影响
    21. Effect of interface reaction and interface tension on wettability of Sn-Zn-Bi solders;
      试验结果表明，该泡沫溶液的表面张力和界面张力很低。
    22. This also applies to solders which can be used under vacuum.
      这同样适用于真空环境下的焊接。
    23. Multiple terminations – Solders, Pin Type, Solder Pad and Wired.
      多样的输出端&焊点，端子，焊盘和输出线。
    24. Bi is effective to lower the melting point but it also makes solders weak and brittle.
      铋能够有效地降低熔点，但是也会使焊锡膏脆弱并容易断裂。
    25. It is used for pressure and vacuum of ammoniac liquid and gas as well as of zhe madia which can't corrode carbon steel, stainless steel and solders like tin and lead.
      仪表适用于测量氨的液体和气体的压力真空，也可测量对碳钢、奥氏体不锈钢和锡铅类焊料无腐蚀作用的介质的压力和真空。
    26. Thermodynamic and Kinetic Investigations of Some Lead-free Solders Systems
      部分无铅焊料体系的热力学与动力学研究
    27. Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors.
      通过盘状及平面陈列陶瓷多层电容器的焊料所含的铅；
    28. Current Research Status of Reactive Wetting and Interface Structure of Sn-based Solders on Cu Substrate
      Sn基钎料/Cu基板间反应润湿及界面结构研究现状
    29. Formation and Evolution of the Microstructures of the Sn-Ag-Zn Solders and the Interfaces with Cu Pad
      Sn-Ag-Zn系无铅焊料及其连接界面组织形成与演化规律
    30. A wettability model of tin based solders is introduced and mathematical manipulation upon it is performed.
      引入了快冷锡基软钎料的浸润性模型，并进行了计算处理。
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