tmah

网络  四甲基氢氧化铵; 氢氧化四甲基铵; 四甲基氢氧化氨

医学



双语例句

  1. Furthermore, the challenge and chance in the study field of TMAH is described, along with our new progresses on the preparation of TMAH.
    对目前国内外市场需求进行了综合分析,指出了目前该领域遇到的挑战和机遇。介绍了作者在TMAH合成和提纯方面取得的进展。
  2. Preparation of mPAA/ CMC-mCS Bipolar Membrane and Application in Electro-synthesis of TMAH
    mPAA/CMC-mCS双极膜的制备及其在电合成TMAH中的应用
  3. TMAH has become a commonly used etchant for MEMS technology because of its high silicon etching rate, which depends on crystal orientation, low toxicity and well compatibility with CMOS technology.
    TMAH具有刻硅速率高、晶向选择性好、低毒性和对CMOS工艺的兼容性好等优点,而成为MEMS工艺中常用的刻蚀剂。
  4. Using tetramethyl ammonium hydroxide ( TMAH) as dispersant for SiC aqueous suspension, the effects of dispersant concentration and pH value on the rheological behavior of SiC aqueous suspension were studied.
    使用四甲基氢氧化铵(TMAH)作为分散剂,研究了分散剂用量对SiC浆料流变性能的影响,并分析了其原因。
  5. After finished the CMOS process, to realize the monolithic integration of CMOS readout circuits with detector arrays, the thermally insulated microbridge structure could be formed by front-end etching of the substrate using TMAH solution compatible with CMOS process.
    在CMOS工艺完成后,辅以与CMOS工艺兼容的体硅微机械加工工艺,制备微桥形式的热绝缘结构,从而方便地实现了CMOS读出电路与探测器阵列的单片集成。
  6. Hydroxy terminated polydimethylsiloxane ( PDMS) was directly synthesized, with tetramethyl ammonium hydroxide ( TMAH) as catalyst and octamethylcyclotetrasiloxane ( D4) as monomer, under the conditions of high temperature, adding water and oxygen-off.
    以八甲基环四硅氧烷为单体,四甲基氢氧化铵为催化剂,水作封端剂,在较高温度、排氧加压密闭的条件下,一步合成羟基聚硅氧烷。
  7. Study on Si Wet-etch with 10% TMAH
    10%TMAH硅湿法腐蚀技术的研究
  8. A method for the determination of trace amount of Pb and Cd in animal bone using GFAAS has been established. The samples were determined directly after being diluted by TMAH solution. The method is handy and fast.
    本文建立了一种用石墨炉原子吸收光谱法测定动物骨中的痕量Pb和Cd的方法,试样以TMAH溶解后直接测定,方法简便。
  9. The etching theory is given and the experimental procedure of three kinds of etchant ( KOH, EPW, TMAH) is reported. Some results obtained are encouraging.
    给出了各向异性腐蚀的机理,报告了三种不同腐蚀液(KOH,EPW,TMAH)的腐蚀工艺及实验结果。
  10. Preparation of tetramethyl ammonium hydroxide ( I) application of TMAH solution in MEMS
    四甲基氢氧化铵(TMAH)的制备(Ⅰ)四甲基氢氧化铵在MEMS中的应用
  11. The Preparation and Purification of TMAH
    四甲基氢氧化铵的制备与提纯综述
  12. In addition, the problem of ester exchange of rosin esters as the function of TMAH and the condition for their determination were proposed.
    本文还提出了有关中性松香施胶剂中松香酯成分由于TMAH作用而产生的酯交换问题及其解决办法。
  13. The anti-etching characterization of the films is carried out in KOH solutions and TMAH solutions at different temperatures.
    本文比较了在不同温度条件下ABS胶膜在KOH和TMAH溶液中的抗腐蚀特性。
  14. Research in Manufacturing Silicon Microstructure with TMAH Solution
    TMAH腐蚀液制作硅微结构的研究
  15. The results indicated that the etching solution velocity of Si ( 100) increased with the increasing of the etching solution concentration and temperature, and the etching solution degree was speeded up with the decreasing of the mol ratio of TMAH/ KOH for different system.
    结果表明:Si(100)面的腐蚀速度随着腐蚀液浓度和温度的升高而增大,随着TMAH与KOH摩尔比的降低,KTMAH腐蚀液对掩膜层的腐蚀程度加剧。
  16. Reactive pyrolysis gas chromatography ( Py-GC) in the presence of an organic alkali, tetramethylammonium hydroxide(( CH3) 4NOH, TMAH), was applied to the compositional analysis of natural resin shellac.
    研究了有机碱试剂,氢氧化四甲铵(tetramethylammoniumhydroxideTMAH)共存下的反应热裂解气相色谱(Py-GC)应用于天然树脂紫胶的化学组成分析。
  17. Characterization of etching of Al film and Si substrate with 10% tetramethylammonium hydroxide ( TMAH) has been done at a condition of adding various amount of Si dust.
    研究了浓度为10%的四甲基氢氧化铵(TMAH)溶液,在不同量的Si粉掺杂下,对铝膜及硅衬底的腐蚀及其pH值的变化。
  18. The Research and Analysis of the Roughness and Etching Rate in Forming Squre Silicon Cup with TMAH Solution
    采用TMAH腐蚀液形成正方形硅杯的粗糙度与腐蚀速率的研究与分析
  19. The experiments respectively studied the effects of alkali with surfactant, TMAH solution, and alkali with sodium silicate on the surface structures of single silicon.
    实验上分别研究了碱液+活性剂、TMAH溶液、碱液+硅酸钠溶液腐蚀的单晶硅表面结构。
  20. In addition, the addition of 0.0004% SDS into the TMAH/ IPA solution could reduce the pyramid size and the surface reflectivity of the silicon wafer.
    在腐蚀液中加入0.0004%的十二烷基硫酸钠可以减小金字塔尺寸,降低表面反射率,提高绒面的质量。