wafer

noun

1. 威化饼，薄脆饼（常与冰激凌同吃）
   a thin crisp light biscuit/cookie, often eaten with ice cream
2. 圣饼；圣体；面饼
   a very thin round piece of special bread given by the priest during Communion
3. 薄片
   a very thin piece of sth

1. 威化饼，薄脆饼(常与冰激凌同吃)
   A wafer is a thin crisp biscuit which is usually eaten with ice cream.
2. (基督教圣餐仪式上牧师发放的)圣饼
   A wafer is a circular, thin piece of special bread which the priest gives people to eat in the Christian service of Holy Communion.

1. Wafer Die Disposition: Various functions related to wafer manufacturing and test.
   WaferDieDisposition：各种与晶片制造及测试相关的功能。
2. A thin crisp wafer made or flour and water with or without leavening and shortening; unsweetened or semisweet.
   面粉和水做成的、发酵或不发酵、酥松或不酥松的薄脆饼干；未加糖或半甜。
3. Nanya forwarded a shipment of wafer to us.
   南亚发了一批晶圆给我们。
4. Study on Dynamic Pressure and Temperature of Slurry in Chemical-Mechanical Polishing of Silicon Wafer
   硅片化学机械抛光加工区域中抛光液动压和温度研究
5. Disclosed is a method and system for testing IC in wafer stage by using passive electric network.
   公开了一种利用无源电气网络进行晶片阶段集成电路测试的方法和系统。
6. Bond strength is an important parameter for wafer bond.
   键合强度是关系到键合好坏的一个重要参数。
7. In one variant of this process the bumps are etched onto the tape rather than deposited on the wafer.
   这种工艺有一种方式是，凸出物被蚀刻在带上，而不是沉淀在硅片上。
8. To smooth the surface of a wafer or semiconductor crystal.
   使晶片或半导体晶体的表面光滑的过程。
9. Crater-Visible under diffused illumination, a surface imperfection on a wafer that can be distinguished individually.
   微坑-在扩散照明下可见的，晶圆片表面可区分的缺陷。
10. Smudge-A defect or contamination found on the wafer caused by fingerprints.
    污迹-晶圆片上指纹造成的缺陷或污染。
11. The Endura platform is a modular, configurable system used to deposit metals and metal alloys on the wafer.
    Endura平台是一个模块化、可配置系统，用于将金属和金属合金安装到硅晶片。
12. Motion control system of an ultra precision wafer stage with application to integrated circuit production was presented.
    描述一种应用于集成电路制造的超精密硅片台系统及其运动控制。
13. Methods and systems of diagnosing an arcing problem in a semiconductor wafer processing chamber are described.
    本发明揭露一种诊断半导体晶圆处理室中的电弧问题的方法及系统。
14. Embodiments of the disclosure include use as a wafer level underfill, and an encapsulant for electronic chips.
    本发明的实施方案包括作为晶片级底层填料和电子芯片密封剂的用途。
15. A vacuum clamp equipment used for holding Si wafer is designed in this paper.
    设计了一套硅片专用真空夹紧装置，包括夹紧装置和微型无油真空抽气泵。
16. The tool is capable of fast2D and3D mapping of Stress or wafer bow.
    设备可以快速对应力和硅片翘曲度进行2D和3D映像；
17. Abstract: this paper introduces the background of using wafer level reliability technology, and expounds the characteristics and functions in details.
    摘要：介绍了圆片级可靠性技术产生的背景，对其特点和作用作了详细的论述。
18. Based on the classification on the scheduling for semiconductor wafer lines, the modular and reconfigurable framework is proposed.
    在分析半导体生产线调度分类的基础上，提出了组件化可重构半导体生产线调度体系结构。
19. This market research report covers the2008 silicon wafer reclaim for the semiconductor market and provides a forecast to2011.
    该市场调研报告涵盖了2008年半导体市场的硅片回收状况以及对于2011年的预测。
20. Waves-curves and contours found on the surface of the wafer that can be seen by the naked eye.
    波浪-晶圆片表面通过肉眼能发现的弯曲和曲线。
21. In this paper, we develop an automatic wafer inspection system.
    在这一篇论文中，我们发展了一个自动化晶圆检验系统。
22. Wafer swing check valve is used to prevent media from flowing backwards in pipeline and device;
    对夹止回阀是用于防止管道和设备使用中介质倒流的一种阀门；
23. The application of wafer bonding technology in long? wave vertical cavity devices is given.
    最后介绍了晶片键合技术在长波长垂直腔型器件研制中的应用。
24. The Advances in Wafer Bonding and MEMS
    晶圆键合技术与微电子机械系统新进展
25. In this paper, part of theoretical and experimental studies on the application of UV laser in dicing of sapphire wafer and SiC were presented.
    本论文对紫外激光应用于蓝宝石晶圆和碳化硅等材料的划切加工技术进行了部分理论与试验研究工作。
26. Hot plate with silicon wafer in initial configuration ( before heating).
    加热板与矽晶圆在启始状态（加热前）。
27. This paper introduces the technology of solid membrane transfer by wafer bonding and its applications.
    阐述了利用键合方法转移薄膜材料的技术及其应用。
28. The method is to coat a wafer of silicon with a protective layer of silicon dioxide.
    其方法是往硅片上涂上一层二氧化硅防护膜。
29. Now people can produce a wafer silicon.
    现在人们能够生产一种硅晶薄片。
30. Integration and Packaging of Sensors and MEMS Devices Through Low Temperature Wafer Bonding
    圆片包封瓷介电容器用低温圆片键合实现传感器和微电子机械系统器件的集成和封装

noun

1. thin disk of unleavened bread used in a religious service (especially in the celebration of the Eucharist)

2. a small thin crisp cake or cookie

3. a small adhesive disk of paste