multi-chip
英 ['mʌlti tʃɪp]
美 [ˈmʌlti tʃɪp]
网络 多片; 多芯片; 多晶粒; 可设计多芯片; 多晶片
复数：multi-chips
双语例句
- Further, it uses Dual Chip Modules ( DCMs) and Multi-Chip Modules ( MCMs) as the basic building blocks for its mid-range and high-end servers, respectively.
此外，它还分别使用双芯片模块（DCM）和多芯片模块（MCM）作为其中端服务器和高端服务器的基本构建块。 - The Research of RF Front-End Applied for Satellite Navigation Communication Handset; Development of a Miniature T/ R Front-end Using Microwave Multi-Chip Module Technology
用于卫星导航定位通信机的射频收发前端研究基于多芯片组装技术的小型微波收发前端研制 - Mask line Machining made of non-woven using high-quality, single and multi-chip packaging, and customers can request for sterilization.
面膜系采用优质无纺布加工制成，有单片和多片包装，并可按客户要求作灭菌处理。 - The pattern metal layer is arranged on the insulation layer and filled into the diversion holes, thereby being an inner linking layer of the multi-chip packaging structure of the utility model.
图案化金属层位于绝缘层上并填入于导通孔中，以作为本实用新型多芯片封装结构的内连线层。 - Performance of a silicon-based embedded MMCM package Development of a Miniature T/ R Front-end Using Microwave Multi-Chip Module Technology
一种硅埋置型微波多芯片组件封装的电性能基于多芯片组装技术的小型微波收发前端研制 - The utility model discloses a multi-chip packaging structure comprising at least a loader, at least a packaging module, an insulation layer and a pattern metal layer.
本实用新型公开一种多芯片封装结构，至少包括一承载器、至少一封装模块、一绝缘层及一图案化金属层。 - In addition, we own advanced and matured multi-chip packing technology.
此外，我们拥有先进且成熟的多晶封装技术。 - Warpage of Three-Dimensional Multi-Chip Module Based on Embedded Substrate
基于埋置式基板的三维多芯片组件的翘曲研究 - Thermal Design of High-Power LED Multi-Chip on Board Package
大功率LED多芯片基板上直接封装的热设计 - Multi-chip Array Combination White Light LED Seal Research
多芯片阵列组合白光LED封装研究 - MCM ( Multi-Chip Module) is presently the most effective method for realizing the miniaturization of airborne radar receiver front-end.
多芯片组件（MCM）是目前实现机载雷达接收前端小型化的最有效途径。 - Development of a Miniature T/ R Front-end Using Microwave Multi-Chip Module Technology
基于多芯片组装技术的小型微波收发前端研制 - Methods The folding splint is composed of multi-chip interlocking head splints, Which can be folded or spread into a long board.
方法：展叠夹板本体包括多片首尾通过铰接装置依次连接在一起的夹板，夹板能够互相折叠或展开成一长板状。 - Routing is a key procedure in the computer-aided-design of multi-chip modules ( MCM's).
布线是多芯片组件（MCM）CAD中的一个关键步骤。 - Based on the theory of the nonuniformity in one CCD sensor, the method of correcting the nonuniformity of multi-chip CCD butting is described.
在分析了单片CCD图像传感器不均匀特性基础上，提出了多CCD拼接相机系统中不均匀特性的校正方法。 - Micro-interconnect is the critical technique for realizing the interconnect of microwave multi-chip module.
实现微波多芯片组件（MCM）电气互连的微连接技术是MCM组装的关键技术。 - Because of adopting the technology of SOC, comparing to the multi-chip system, this chip not only depresses the cost, but also improves the system capability and stability.
此数字调谐系统由于采用了SOC技术，所以较以前由多个芯片拼接而成的DTS系统，在降低了芯片成本的同时，系统性能和稳定性也有了大幅度的提高。 - The thermal analysis of the Multi-Chip Module ( MCM) is crucial for enhancing module reliability.
多热源、大功率多芯片组件（MCM）热分析的研究是提高其可靠性的关键。 - Chip Stress Analysis and Structure Optimization in Stacked Multi-Chip Package
多芯片叠层封装中的芯片应力分析及结构优化 - This article mainly summarizes the development of MCM ( multi-chip model) technology at home and abroad, analyses problems in this technology and the key point in its future development, and describes its common applications.
本文主要分析、总结了国内外多芯片组件（MCM）技术发展现状与存在问题，以及今后技术发展重点和主要应用方向。 - Results in the paper will supply references to thermal designs of multi-chip module packaging based on diamond material.
本文对金刚石材料在多芯片组件热性能改善和热应力研究，对金刚石在多芯片组件封装热设计应用具有一定的参考价值和提供一定的理论依据。 - These FETs are suitable for multi-chip use with higher power combining efficiency.
这种FET的多芯片运用具有优良的功率合成效率。 - Study on the Simulation of Interconnects in Microwave Multi-Chip Module
微波多芯片组件中互连的仿真研究 - Moreover, some major processes package of MEMS, including wafer-level packaging, single-chip packaging, multi-chip packaging and stacked 3D packaging, etc were discussed.
阐述了MEMS的主要封装工艺和技术，包括圆片级封装、单芯片封装、多芯片组件和3D堆叠式封装等。 - With analysis for the logic resources and memory requirements of AVS video decoder, a single high-end high-capacity FPGA from Altera Corporation was selected to overcome I/ O shortages brought by small-capacity multi-chip FPGAs.
通过对AVS视频解码器逻辑资源和存储器的需求分析，选用了Altera公司单片高端大容量FPGA，克服了多片小容量FPGA带来的I/O紧张问题。 - The thermal characteristics in transient-state of two structures of hundred-watt semiconductor laser packaged with multi-chip was necessarily analyzed.
关于两种多芯片封装的百瓦级半导体激光器的瞬态热特性也作了必要的分析。 - This article on the problems of these studies, combined with multi-chip flash memory can be operated in parallel, we proposed a new recognition algorithm of hot and cold data in order to reduce additional erased.
因此本文上对上述存在的问题进行了研究，结合多片闪存可并行操作的特点，提出了一种新的冷热数据识别算法，以减少额外擦除。 - What is more, the change regularities of the temperature difference and temperature rise by thermal coupling were derived. Finally, the heat-dissipation structures of semiconductor laser packaged with single-chip and multi-chip were designed and optimized, putting forward new heat sink packaging project.
最后，对所分析的单芯片和多芯片半导体激光器的散热结构均进行了设计和优化，提出了新的热沉封装方案。 - In summary, the FPGA-based multi-chip NAND FLASH parallel storage controller, not only has the value of theoretical research, but also has practical value in SSD design.
综上所述，基于FPGA的多片NANDFlash并行存储控制器的设计实现，不仅具有理论研究的价值，在SSD设计实现方面有实际的利用价值。 - Embedded system will completely break the traditional multimedia player with multi-chip architecture, Instead of control processes by and low-power and high-performance of single-chip, and provide a great convenience for feature upgrades and expansion.
嵌入式系统的加入，将彻底打破传统多媒体播放器的多芯片架构，以单芯片的低功耗、高性能完成所有的控制过程，并对以后的功能升级及扩展提供了很大的便利。