multi-chips

英

美

(multi-chip 的复数) [计]多芯片
multi-chip 的复数

The Method Study and Implementation of Temperature Control Based on Multi-chips MOCVD System
多片式MOCVD系统温度控制方法研究与实现
And from single chip package to multi-chips system-in-package ( SiP).
从单芯片封装发展到复芯片封装的构装方案等。
Being based on actual multi-chips module packaging structure a three dimensional thermal analysis model is built, thermal analysis on multi-chips module is conducted using diamond substrate and thermal interfacial materials;
本文根据实际的多芯片组件的封装结构，建立了三维温度场分析模型，分析了金刚石作为导热层和基板对多芯片组件散热性能的改善；
Thirdly, we introduced fundamentals of heat transfer theory, presented the prevailing chip-cooling technologies with high efficiency. A thermal modeling and parameters analysis of multi-chips array package integrated with an innovative micro-channel cooling module was fully investigated.
其次，介绍传热学理论基础以及目前高效的芯片制冷技术，建立多芯片阵列集成冷却模块的热学模型并进行参数分析。
The packaging both for single-chip and multi-chips could meet the heat-release requirement for high-power LEDs.
该封装结构无论是应用于单芯片还是多芯片阵列封装，都可以满足LED的散热要求。