solder

noun

1. 焊料；焊锡
   a mixture of metals that is heated and melted and then used to join metals, wires, etc. together

verb

1. 焊接；焊合
   to join pieces of metal or wire with solder

1. VERB 焊;焊接;焊合
   If you solder two pieces of metal together, you join them by melting a small piece of soft metal and putting it between them so that it holds them together after it has cooled.
   1. Fewer workers are needed to solder circuit boards...
      焊接电路板需要的工人更少了。
   2. He then soldered the wire to the telephone terminal...
      接着他把电话线焊接到电话机上。
   3. He cuts the pieces and solders them together.
      他把那些断片切碎，然后把它们焊在一起。
2. 焊料;焊锡
   Solder is the soft metal used for soldering.

1. Fewer workers are needed to solder circuit boards
   焊接电路板需要的工人更少了。
2. He then soldered the wire to the telephone terminal
   接着他把电话线焊接到电话机上。
3. He cuts the pieces and solders them together.
   他把那些断片切碎，然后把它们焊在一起。
4. The stainless tubing is less likely to kink than copper, but it is harder to solder without an acid treatment.
   不锈钢管比铜管不易纠结，但不经酸性处理焊接较困难。
5. Joints between reinforcement members can be made satisfactorily with tin solder.
   锡焊能够满意地做成加筋构件之间的接头。
6. Are LCD's and UCLA's defined for the average and range of Solder Paste measurements?
   对锡膏厚度测量的平均值和间距是否定义了其控制上限和下限？
7. Wettability of Sn-Zn, Sn-Ag-Cu and Sn-Bi-Cu Lead-free Solder Alloys with Copper Substrate
   Sn-Zn，Sn-Ag-Cu和Sn-Bi-Cu无铅焊锡合金与铜的润湿性
8. Therefore, to improve the reliability of solder joints is one of the most important tasks for electronic industry.
   因此提高焊点的可靠性及寿命是电子业界相当重要的一个课题，故本研究也将朝这方面去执行。
9. Effect of Alloying Elements and Aging on Microstructure and Solder Interface of Sn-Zn Lead-free Solders
   合金元素及时效处理对Sn-Zn无铅钎料组织和钎焊界面的影响
10. This paper discusses the solder printing process technological key points and the common breakdown problem solution.
    文章主要探讨焊膏印刷过程中操作技术要点和应注意的问题，以及一些常见故障的处理方法。
11. Resistance diffusing soldering of copper and mild steel Static contact Electrode shape Inserting solder Potential difference;
    铜与低碳钢电阻扩散焊；静触头；电极形状；嵌料；电位差；
12. Because of this, all parts should be of excellent quality and all solder joints must be tight.
    正因为如此，各部分应该是优良的品质和所有焊点必须紧绌。
13. Solder paste, screen printing, use ways, printing process course will decide the printing quality.
    在锡膏印刷工艺中，锡膏、丝印机、锡膏使用方法和印刷工艺过程将影响到印刷质量。
14. BGA Assembly Technology Research for Solder Ball's Reliability
    对BGA封装技术中锡球焊接可靠性的研究
15. This course covers the detailed material considerations required for achieving high reliability for lead-free solder joints.
    此课程涵盖了高可靠无铅焊点、材料选择的详细要求。
16. They forget to solder the contacts.
    他们忘记了焊接切点。
17. When installing solder end valves, conventional soldering techniques should be used.
    安装焊接连接端口的阀门时，应该采用普通焊接技术。
18. Undiluted Platinum-Preorders, Pro-Installs, Solder Info, and more on the way!
    未稀释白金-预订，赞成安装的，焊接剂信息，和在途中更常！
19. The paper presents the comparison of printed circuit board solder ability test results measured before and after cleaning.
    本文比较了印刷电路板在清洗表面之前和之后的焊接能力测量结果。
20. If you add solder and you can make that circuit substitute for a maze of conventional wiring.
    如加上焊料，你就可以使板上面的电路代替那种用旧方法连接起来的迷宫一样的线路。
21. Soldering flux meeting the lead-free requirements is used for the lead-containing solder paste manufactured by our company.
    本公司生产的有铅锡膏已采用符合无铅要求的助焊膏。
22. And the different section shape of the solder joint is given with the variation of solder volume.
    给出了不同的钎料量对应的焊点剖面形态的变化。
23. Effect of Ag and Ni on melting temperature and spreadability of Sn-SbCu solder alloy
    Ag和Ni元素对Sn-Sb-Cu无铅钎料熔化温度和铺展性能的影响
24. The interconnection between sensor and substrate was realized by molten solder droplet bonding in this study, and the joint configuration, forming process and microstructure were analyzed.
    本文利用钎料熔滴键合方法实现了传感器与基板焊盘之间的互连，对这种工艺下的接头形态、接头的形成过程及微观组织特征进行了研究。
25. The extremely thin oxide coat will also hinder the solder wetting effect on metal surfaces.
    而极薄的氧化层也将防碍金属表面上焊锡的润湿作用。
26. A new method for the simultaneous dissolution and determination of tin and silver in copper solder was reported.
    提出了简单、快速地同时溶解及测定铜基锡银焊料中锡银的新方法。
27. The welding quality of the solder joint on the conducting wire connected with the soldering cover and the PCB.
    导线在接插件焊杯内的焊点和导线在印制板上的焊点的焊接质量。
28. Other effects of lead-free solder paste demolding performance factors such as having a mesh size and aspect ratio.
    其它感化无铅焊膏脱模本能机能的成分包含网孔尺寸和宽矮比。
29. Quality problem and solution on lead-free solder was reviewed.
    并对无铅焊接特有的质量问题及解决方法进行了评述。
30. Do not use the other metal components contact solder paste.
    勿使用其它金属成份接触锡膏。

noun

1. an alloy (usually of lead and tin) used when melted to join two metal surfaces

verb

1. join or fuse with solder
   1. solder these two pipes together